El Departamento de Electrónica invita al examen para optar al grado de Magíster en Ciencias de la Ingeniería Electrónica, mención Telecomunicaciones, del alumno Manuel Méndez Jiménez. Su investigación se titula "Compresión de Imágenes utilizando JPEG2000 con Métricas de Distorsión Basadas en SSIM". A las 14:00 horas, en sala B-221, USM Casa Central.
Junto al Director del Departamento de Electrónica tengo el agrado de invitarle a participar en la conferencia "3D Printed Multi-Functionality and Chip Design for Space", dictada por el profesor Eric MacDonald.
Abstract Recently, research has focused on 3D printing for not only creating conceptual models but functional end-use products as well. By democratizing the manufacturing process, products will soon be fabricated locally and with requirements specified individually by the end user. However, currently 3D printing is generally limited to single material fabrication and consequently can only create structures such enclosures and conceptual models. For additively manufactured end-use products to be truly meaningful, additional features and functionalities will need to be incorporated in to the final structures in terms of electronic, electromechanical, electromagnetic, thermodynamic, biological, chemical and pharmacological content. In the last decade, research has been reported of embedding electronic components and electrical interconnect into 3D printed structures either by interrupting the process or by inserting the additional content after the structure has been built. However, only until recently and with an investment from the presidential initiative on Additive Manufacturing has there been a concentrated research focus on developing technology that produces multi-functionality with an enhanced version of 3D printing, where additional complementary manufacturing technologies are leveraged with 3D printing. This presentation will describe the research of the Multi3D Manufacturing System under development at UTEP as well as chip design efforts for Rad Hard electronics to be embedded within the structures destined for space.
Eric MacDonald's Biography Eric MacDonald, Ph.D., P.E. is the Texas Instruments Endowed Professor in the Department of Electrical and Computer Engineering and associate director of the W. M. Keck Center for 3D Innovation at the University of Texas at El Paso. Dr. MacDonald received his B.S. (1992), M.S. (1997) and Ph.D. (2002) degrees in Electrical Engineering from the University of Texas at Austin and has held faculty fellowships at NASA’s Jet Propulsion Laboratory, the Office of Naval Research and a State Department Fulbright Fellowship in Valparaíso, Chile. His research interests include 3D printed multi-functionality and electronics for low power applications and harsh environments with over 50 refereed publications and three patents (one of which was licensed by Sony from IBM). Prior to joining UTEP in 2003, he co-founded Pleiades Design and Test, Inc. - later acquired by Magma Design Automation, Inc. (Santa Clara, California) and he also worked for both IBM and Freescale Semiconductor in Austin, Texas as a logic and circuit designer. He is a member of ASEE, senior member of IEEE and a registered Professional Engineer in Texas.
Se invita cordialmente al siguiente Examen de Grado:
Alumno: SEBASTIÁN IGNACIO MUÑOZ GARRIDO Opta al Título y Grado: Ingeniero Civil Electrónico y Magíster en Ciencias de la Ingeniería Electrónica, mención Electrónica Industrial Título Tesis: "Métodos de Control de Potencia en Rectificador Trifásico de Frente Activo para la Conexión de Fuentes de Energías Renovables a la Red" Comisión: Dr. Marcelo Pérez, Director de Tesis Dr. Samir Kouro, Profesor Dpto. Electrónica Dr. Miguel López, Examinador externo, P. Universidad Católica de Valparaíso Fecha y hora: Viernes 10 de julio 2015, 11:30 hrs. Lugar: Auditorio "Guillermo Feick" (B.221)